Classification of mobile phone connector

Mobile phone connector development today, can really use the mobile phone industryonly five: FPC connector, board to board connector, I/O card connector, connector and battery connector, then we will be the fifth one by one analysis of mobile phoneconnector.

Battery connector, battery connector can be divided into spring type and switch type.The technical trend of battery connector is mainly for the miniaturization, the new battery interface, low contact resistance and high connection reliability.

The board to board connector, to board connector development trend in mobile phone board is pin spacing and height is smaller, at present mainly based 0.4mmpitch, will gradually develop to 0.35mm or smaller, lower height and subsequent requirements with shielding effect. At the same time BTB (board to board connector)height also gradually reduced to 0.9mm.

I/O connector, I/O connector is one of the most important in the mobile phone access,connect the power and signal contains two parts, reducing the volume and product standards will be the main direction of future development. Now, more use of thecircular and MiniUSB connector, mobile phone with MicroUSB connector in the promotion of the EU and the GSM association gradually formed under thedevelopment of standardization, the current market is the mainstream 5pin, because the mobile phone manufacturers have mobile phone of each scheme, the development trend of the MicroUSB connector to appear standardization and customization of combining the development trend at the same time, Headset plug inconnector was also the same as in 2012, foreign will mainly use the MicroUSB as the standard interface charge, Nokia, Moto and SEMC and other mobile phonemanufacturers have begun to take a substantial step. Then asked connector thinner,with visual effects and waterproof function.

Card connector, 6pinSIM card connector with card connector and T-flash connector,the future direction of development is mainly improved in the connector shielding function and thickness and SIM card, ultra low thickness reaches a minimum of 0.50mm, at the same time card connector products for the development of multi functional +T-flash connector, SIM card connector combo products have appeared on the market.

For the FPC connector, FPC connector for LCD display to the driver circuit (PCB)connected, at present 0.4mmpitch products.

The main material of connector

The main materials - plastic

The main embodiment to numerous useful material there are many but generallybelongs to the field of Engineering plastics.

The main PA46, PA9T, LCP, PBT, PPS, PA66 etc. among them PA46, LCP, HTN material thermal deformation temperature of PPS (HDT) is relatively high, generally used with SMT type products, and several other is used for DIP type products.

Terminal (TERMINAL) material

The existing terminals are used in copper, copper brass, phosphor bronze, beryllium copper, beryllium copper prices due to high, toxic and other defects, has basically been eliminated, the vast majority of terminals used material for phosphor bronze, but the PIN needle type terminal useful brass, general terminal for modulus of continuity ofproduction, so the copper with a roll, the most used PB C5210 and PB C5191 two grades, and points have different levels of hardness, 1/4H, 1/2H, 3/4H, H, EH, SH, SHto the more to the greater hardness.

Connector test

The mechanical part

A, insertion force (Mating &unmating Force)

Distance will function on each card, and between the conductors

Three, insulation resistance (Insulation Resistance)

Verification of such as heat, moisture or pollution factors influence of insulatingmaterial of connector insulation impedance

Part of the environmental

One, the solder temperature (Soldering Heat)

Verify the connector changes in its mechanical properties in the solder temperature point

Two, cycling (Humidity Temperature Cycle)

To verify the influence of high and low temperature and moist environment on themechanical and electrical characteristics of the connector

Three, the high temperature experiment (High Temperature)

Verify the connector in the specified, changes in high temperature air for hours and hours of the mechanical and electrical characteristics of the

Four, the impact of hot and cold (Thermal Shock)

Effects of high ambient temperature verification with extremely low upheaval on the connector mechanical and electrical characteristics of the

Five, sulphide test (Sulfur Dioxide Test)

In a closed space through to the sulfur dioxide gas characteristics change validationproducts in the corrosive gas environment

Six, salt spray test (Salt Spray)

Simulated sea damp, salty hot environmental verification of connector terminals in the environment and iron surface corrosion degree

Seven, ammonia test (Ammonia)

In a certain concentration of ammonia, change characteristics to verify the connector through after a certain time

Eight, solderability (Solder ability)

Verification terminal after electroplating tin pin solderability